Electronics Industry Research Articles

Analyzing the factors influencing the creation of a toxic workplace in the electronics industry:a fuzzy cognitive map approach

Purpose This study aims to identify the factors influencing the creation of a toxic workplace and to examine how to improve a toxic workplace in the electronics industry. Design/methodology/approach First, the factors that influence the creation of a toxic work environment were identified by reviewing the research literature. Then, the current status of each identified factor in Iran’s electronics industry was evaluated by developing a questionnaire. Based on the survey data, a relationship map between the factors influencing the toxic workplace was created using the fuzzy cognitive mapping technique. Finally, scenarios were designed to improve the toxic workplace. Findings The results show that the “workplace bullying” factor is the factor with the highest centrality in relation to other factors. The results of the scenario design indicate the effectiveness of the “unrealistic expectations at work” factor as a scenario trigger. Originality/value This study helps reduce the toxic workplace in the organization, which plays an important role in improving the employees’ work performance and the organization’s development.

Classification of e-waste using machine learning-assisted laser-induced breakdown spectroscopy.

Waste management and the economy are intertwined in various ways. Adopting sustainable waste management techniques can contribute to economic growth and resource conservation. Artificial intelligence (AI)-based classification is very crucial for rapid and contactless classification of metals in electronic waste (e-waste) management. In the present research work, five types of aluminium alloys, because of their extensive use in structural, electrical and thermotechnical functions in the electronics industry, were taken. Laser-induced breakdown spectroscopy (LIBS), a spectral identifier technique, was employed in conjunction with machine learning (ML) classification models of AI. Principal component analysis (PCA), an unsupervised ML classifier, was found incapable to differentiate LIBS data of alloys. Supervised ML classifier was then trained (for 10-fold cross-validation) on randomly selected 80% and tested on 20% spectral data of each alloy to assess classification capacity of each. In most of the tested variants of K nearest neighbour (kNN) the resulting accuracy was lower than 30% but kNN ensembled with random subspace method showed improved accuracy up to 98%. This study revealed that an AI-based LIBS system can classify e-waste alloys rather effectively in a non-contactless mode and could potentially be connected with robotic systems, hence, minimizing manual labour.

EXPRESS: The Effects of Collectivism and Organizational Tenure on the Emergence of Pre-Release Digital Piracy

As businesses increasingly move into digital domains, digital piracy has become more prevalent and more costly. Pre-release piracy, where pirated versions of digital products are distributed before legitimate ones, remains particularly damaging to digital product developers. Although workers’ social norms may play a critical role, limited research exists on the behavioral factors that intentionally or unintentionally contribute to pre-release piracy, particularly when considering multinational nuances (e.g., national cultures) and workers’ experience (e.g., organizational tenure). To address this gap, we develop and test an empirical model of how national culture and organizational tenure jointly predict the likelihood of pre-release piracy. Our empirical analyses employ a dataset compiled from more than twenty distinct sources and capture the electronic video game industry’s PC-based products from 2000 through 2019. For national culture, we focus on two forms of collectivism – institutional and in-group – finding that institutional collectivism is associated with a reduced likelihood of pre-release piracy, while in-group collectivism increases it. We also find that the likelihood of pre-release piracy reduces with a product development team’s organizational tenure, but that this relationship is distinctively moderated by each of collectivism’s two forms. Specifically, the benefits of increased organizational tenure are amplified in the presence of stronger institutional collectivism but muted in the presence of stronger in-group collectivism. We link our findings to research streams on national culture, digital piracy, and organizational tenure, and specify contributions to each.

Decreasing the dielectric constant and water uptake of co-polyimide films by introducing bulky spirobifluorene and cross-linked tetrafluorostyrol groups

With the diminishing gap between the internal components of chips, the signal transmission delay poses a substantial threat to chip performance. To enhance the transmission speed of electrical signals, the development of materials with a low dielectric constant (Dk) becomes imperative. Polyimide (PI), categorized as a specialized engineering material, exhibits a high Dk (≥3), posing challenges in meeting the requirements of electronic and communication industries. Consequently, a new diamine monomer named BTVFD, characterized by spirobifluorene and cross-linkable tetrafluorostyrol groups, was synthesized. It was copolymerized with 2,2′-bis(trifluoromethyl)-[1,1′-biphenyl]-4,4′-diamine (TFDB) and 4,4′-(hexafluoroisopropylidene)diphthalic anhydride (6FDA) to synthetize cross-linkable polyimides (TBPIs) with different BTVFD content. The cross-linked TBPIs (CL-TBPIs) were obtained by thermal cross-linking reaction. The study results demonstrate the Dk of PIs is significantly reduced through this effective strategy. Notably, CL-TBPI-2 exhibits outstanding comprehensive performance with low Dk (1.88@10 MHz) and dielectric loss (0.00513@10 MHz), low water uptake (0.125 %), high thermal decomposition temperature (5 % weight loss at 553 °C) and glass transition temperature (374 °C), excellent tensile strength (121.8 MPa) and nice transparency and flexibility.

Development of the Bipolar Junction Transistor Diagnostic Test (BJTDT) to explore the second-year undergraduate Myanmar electronic and Thai electrical engineering students’ understanding of BJT working principles and applications

ABSTRACT A bipolar junction transistor (BJT) and its operation are fundamental concepts for the understanding of power electronics (industrial electronics), transistor-transistor logic (TTL), electronic switching, and signal amplification in modern electronics. Previous research showed that non-major engineering, computer, electronic, and electrical engineering students could not understand the basic concepts involved in a BJT. This paper describes the development of a two-tier diagnostic test, the test’s administration, limitations, the participants’ detailed context, and findings from a study that explores Myanmar and Thai second-year undergraduate students’ understanding of BJT working principles and applications. The results revealed that many students in both countries had the same alternative conceptions about collector current in each operation mode of the BJT. Some alternative conceptions differ from the previous research, such as a) the collector current does not depend on the base current in cut-off mode, and b) changing the collector current does not depend on the base current in active mode, but it depends on the collector supply voltage. These research findings provide valuable information and instruments for teachers to insight, prevent, and correct the alternative conceptions proposed by students.

Underwater dissimilar friction stir lap welding of aluminum alloy and CFRTP

With the rapid development of the transportation and electronic equipment industries, the demand for robust joining technology for metal/polymer has become imperative, especially in the pursuit of lightweight solutions. Underwater welding is one of the methods to reduce the formation of holes and other welding defects, which is conducive to improve the quality and strength of joints. In this study, the underwater friction stir lap welding (UFSLW) of 6061-T6 Al alloy and carbon fiber reinforced thermoplastic (CFRTP) joints is investigated. The welds are evaluated by optical microscope (OM) image, scanning electron microscope (SEM), and energy dispersive X-ray spectrometer (EDS) of the fracture, tensile, and hardness analysis. Research reveals that the presence of cracks and tunnel defects similar to those in air FSLW (AFSLW) is reduced in the underwater welding process. From the microscopic result analysis, the rapid dissipation of frictional heat and substrate viscosity in the cooling medium of circulating water in the stirring zone reduces the interaction between Al alloy and molten CFRTP, which leads to the rapid transformation of the plasticized material into a solid state and reduces the formation of thick stacked layer. In addition, finer Al alloy fragments are obtained in the welding zone due to the fast cooling rate. Ultimately, the maximum tensile strength of 32.12 MPa is achieved, which is 10.76% higher than that of the same welding parameters in air. Based on UFSLW technology, the joint strength of this study is 69% higher than that of Al alloy and polymer joints, which demonstrates enormous application potential and opens up new prospects for the joining technology of dissimilar materials.

Iodine intercalation-assisted alkali activation constructs coal-based porous carbon for high-performance supercapacitors

Supercapacitors have the advantages of fast charging and discharging speeds, high power density, long cycle life, and wide operating temperature range. They are widely used in portable electronic equipment, rail transit, industry, military, aerospace, and other fields. The design and preparation of low-cost, high-performance electrode materials still pose a bottleneck that hinders the development of supercapacitors. In this paper, coal was used as the raw material, and the coal-based porous carbon electrode material was constructed using the iodine intercalation-assisted activation method and used for supercapacitors. The CK-700 electrode exhibits excellent charge storage performance in a 6 M potassium hydroxide (KOH) electrolyte, with a maximum specific capacitance of 350 F/g at a current density of 0.5 A/g. In addition, it has an excellent rate performance (310 F/g at 1 A/g) and cycle stability (capacitance retention up to 91.7 % after 30000 cycles). This work provides a method for realizing high-quality, high-yield and low-cost preparation of coal-based porous carbon, and an idea for improving the performance of supercapacitors.

Experimental Study of Thermal Contacts for the Enhancement of Interfacial Heat Transfer

Abstract The thermal management in high-performance electronic devices demands the enhanced rate of heat dissipation for controlling operational temperatures and achieving optimal functioning. There are many interfaces in the heat dissipation circuit where thermal interface materials are applied to enhance heat transfer rate. An experimental investigation is presented on metallic contacts to study the interfacial heat transfer with and without a thermal interface material. Thermal contact conductance is known to be an important parameter estimated for the analysis of interfacial heat transfer across the thermal contacts. Therefore, the thermal contact conductance has been evaluated to identify an effective thermal interface material suitable for the present range of contact pressure and heat flux conditions. Silicone grease is a widely used thermal interface material in electronic industry. Thus, commercially available Silicone grease is evaluated in different boundary line thicknesses for a range of contact pressure and mean interface temperatures. Further, a novel composite thermal paste has been prepared by mixing cupric oxide nanopowder and Silicone grease in three different mass concentrations. Eventually, the results for the new thermal paste showed improved thermal contact conductance and lower interfacial temperature drops as compared to Silicone grease for similar test conditions with few limitations.

Manufacturing Shape-Controllable Flexible PEDOT/rGO Composite Electrodes for Planar Micro-Supercapacitors.

Flexible electronic products, with their characteristics of flexibility and wearability, have attracted significant attention and have become an important direction in the research and development of the electronics industry. Planar micro-supercapacitors (MSCs) with flexible composite electrodes can provide reliable energy support for these products, propelling their further development. The research employed a quick, effective, and environmentally friendly method of laser scribing to create shape-controllable flexible composite electrodes on composite films of Poly(3,4-ethylenedioxythiophene) and graphene oxide (PEDOT/GO), which were subsequently assembled into MSCs. An analysis of the composite electrode morphology, structure, and elemental distribution was conducted through the utilization of SEM, TEM, and XPS techniques. Following this, a comprehensive evaluation of the electrochemical performance of the flexible MSCs was carried out, which included cyclic voltammetry (CV), galvanostatic charge/discharge (GCD), and assessment of cyclic stability. The analysis of the CV results indicated that the MSCs achieved the areal capacitance of 5.78 mF/cm2 at 5 mV/s. After 5000 cycles at a current density of 0.05 mA/cm2, the capacitance retention rate was 85.4%. The high areal capacitance and strong cycle stability of MSCs highlight the potential of PEDOT/reduced graphene oxide (PEDOT/rGO) electrodes in electrode applications.

THE IMPLICATION OF ELECTRONIC BANKING ON INDIAN BANKING SECTOR

Currently, India is the nation that is developing at the quickest rate in the globe, and since the demonetization of the country in 2016, there has been a spike in the e-banking industry of India. In the modern, digitalized world, electronic banking has become an essential component. The purpose of this study was to collect data regarding the history of electronic banking in India, analyze the current state of electronic banking in India through the use of surveys, and attempt to forecast the future of the electronic banking industry in India. In this study, we investigated seven distinct aspects that are associated with electronic banking in India. Alternative methods of conducting business Quantity of users Innovative technological developments in online banking the sum of all funds sent through electronic banking Policies of the government Educating the general audience about the various services that are provided via online banking In order to obtain the necessary information, we first carried out a survey in the city of Pune and its surrounding areas. Subsequently, we examined the data and attempted to make predictions regarding the future. Throughout the survey, we inquired about a variety of topics, including the respondents' preferred banking method and the number of transactions they completed on a weekly basis. After that, we put the information that we had gathered from the survey and the RBI through an analysis, and based on the findings of that study, we attempted to make a prediction about the future in two stages. Keywords:- Implication , Electronic, Banking, Sector, India

Analysis and prediction on carbon emissions from electrical and electronic equipment industry in China

This research employs the IPCC methodology to assess carbon emissions from China's Electrical and Electronic Equipment (EEE) industry for 2012–2020, utilizing the GM (1) model to predict emissions for the next decade. Six scenarios evaluate emissions, guiding strategies for reduction. Key findings reveal the usage phase as the highest emitter, while WEEE dismantling incurs the lowest. In 2020, emissions from production, sales, transportation, usage, recycling transportation, dismantling, and recycling were projected. Scrapping imported EEE from 2012 to 2020 results in 1.88 million tons of emissions. Projected 2030 emissions, under current policies or low-carbon measures, are 136 million tons and 72 million tons, respectively. Urgent actions, especially in Extended Producer Responsibility (EPR) and stakeholder roles, are essential. The study advocates for consumer awareness on energy conservation and reducing dependence on imported products. Manufacturing emissions highlight the need for eco-design, emphasizing sustainable practices. Recycling and dismantling phases also contribute emissions, necessitating optimized routes and advanced technologies. In addition, the study explores the potential for carbon reduction by incorporating the organic combination of carbon trading markets, evaluating the carbon emission reduction potential of recycling enterprises. The proposal suggests replacing government subsidies with the sale of carbon credits, not only to stimulate companies to actively promote green dismantling but also to address the current inadequacy of subsidies. Establishing a comprehensive life cycle management system is crucial to minimizing the EEE industry's carbon footprint and promoting a sustainable future.

Occurrence, source apportionment and ecological risk of bisphenol analogues in river sediments in areas with different land use patterns

Bisphenol analogues (BPs) have gained increasing attention in recent years due to their ubiquitousness and potential endocrine disrupting properties in environments. However, little information is available on their spatiotemporal distribution, source apportionment and ecological risk in river sediments, especially the case in river basins with a high population density and those typical regions with agricultural-urban gradient, where land use patterns and intensity of human activity are varying. In this study, field investigations of BPs in the sediment of the entire Qinhuai River Basin, a typical agricultural-suburban agricultural-urban gradient area, were conducted before and after the flood period. Thirty-two sites were sampled for six types of BPs, resulted in no significant difference in the concentration of ΣBPs between the two periods, with ΣBPs ranging from 3.92–151 ng/g and 2.16–59.0 ng/g, respectively. Bisphenol A (BPA) was the main contributor. Whereas a multivariate analysis of variance (MANOVA) suggested that the composition structure of BPs had been influenced by water periods. The land use patterns had an impact on the distribution of ΣBPs in river sediments, which was more significant in after the flood period, with ΣBPs in urban rivers was 1.85 times, 3.44 times, and 3.08 times higher than the suburban rivers, agricultural rivers, and reservoirs, respectively. Yet land use types did not significantly alter the composition structure of BPs. The correlation analysis between BPs and the physicochemical properties of sediments showed a significant positive correlation between BPA and total organic carbon (TOC). The positive matrix factorization model (PMF) suggested that BPs in sediments of the basin might be influenced by industrial coatings, textiles, electronics and biopharmaceuticals, as well as urban wastewater or solid waste generated from daily life. The ecological risk assessment posed by BPA, based on the risk quotient, indicated that the ecological risk of BPA in sediments was low for three indicator benthic organisms: crustaceans, worms, and mollusks. However, the risk of BPA in river sediments varied among different land use patterns, with the risk ranking as follows: reservoirs < agricultural rivers < suburban rivers < urban rivers.

Development of Microcontroller Based Water Quality Monitoring and Water Level Control Device

Access to clean and safe water is not only a fundamental human right but also a vital requirement for electronics industries, chemicals industries, pharmaceuticals, food and beverage production, fisheries and aquatic farming. This project addresses the pressing issue of water quality monitoring and efficient water usage within the context of these industries. The study's identification of problem areas for water quality can lead to more efficient interventions and solutions to safeguard the environment, and prevent waterborne diseases. This paper presents the design and implementation of microcontroller-based system for monitoring water quality and water level in the thank, the water in the thank is refilled when it goes beyond a set threshold with the aid of an automatic switch control. The system is a hybrid of 3 subsystems: a Water Level Checker, a Water Quality Monitoring System and an Automatic Switch control system. The Water level checker consists of Ultrasonic sensors. The Water Quality Monitoring system consists of pH sensors, TDS (Total Dissolved Solids) sensors and Turbidity sensors. The continuous (Analog) data from the water quality sensors used would be outputted via an LCD (Liquid Crystal Display). The Automatic Switch control system consists of 5v Relay modules and a 12v Pump that would automatically switch ON/OFF depending on the level of water in the tank. The values of EC (Electrical Conductivity) and TDS spike drastically to the introduction of salt from as low as 138 -906 for TDS and 0.34 – 2.04 for EC, signifying increase in water capacity of electrical conductivity. Temperature rise in the afternoon also increases TDS values from 142 for clean water to 920 for the salty water while it ranges from 138 for clean water to 906 for salt water at both morning and evening time. Pumping aspects of the system are triggered when water level in the thank falls below 10% and trips off when water level goes above 95% as programmed in the control unit. The developed system marks a significant achievement in water management and automation technology. integration of quality monitoring sensors has enabled real-time evaluation of water parameters that holds potential for applications in environmental monitoring, ensuring safe drinking water, and safeguarding aquatic ecosystems. The automated switch control mechanism responds dynamically to water levels, enabling the system to trigger actions such as pump activation or filling processes based on predefined thresholds.

Tributyl(hexyl)phosphonium chloride as a new leveler for microvia copper superconformal electronic plating

A phosphorus-containing new compound of tributyl(hexyl)phosphonium chloride (TBHP), but not the commonly used nitrogen-containing heterocycles and quaternary ammonium salts, is successfully applied for the superconformal copper filling of microvia in acid sulfate electroplating bath for the application of electronic industry. The molecular interaction mechanisms of TBHP combined with suppressor (polyethylene glycol, PEG) and accelerator (bis-(sodium sulfopropyl)-disulfide, SPS) are investigated in detail. Galvanostatic measurements at platinum rotation disk electrode indicate that the leveler of TBHP among with the suppressor and accelerator behaves the key characters of inhibition and convection-dependent adsorption during copper ions electroreduction for the bottom-up filling of microvia. Cyclic voltammetry measurements and in-situ FTIR spectroscopy further reveal that TBHP synergistically interacts with the suppressor to inhibit copper ions electroreduction at the mouth of microvia; while TBHP competes for adsorption with the accelerator, behaving as TBHP gradually replaced by the accelerator at the bottom. Based on the sufficient theoretical supports, the practical copper electroplating is conducted for the verification of microvia void free filling. In the developed novel copper plating formula containing TBHP, PEG and SPS, the void free filling is successfully achieved and the filling percentage (FP) is high in 95.5%.

Design insights into a junctionless nanosheet FET (JL-NSFET) for switching and Analog/RF applications: Device to circuit level assessment

- The advent in semiconductor technology paved the way for electronic industry to place in front row. The nanosheet (NS) device is a type gate all around (GAA) architecture provides an excellent gate electrostatic to suppress the short channel effects (SCEs) and scale it further below sub-7nm technology node. This paper provides a complete design insight from device to circuit of a two sheet NSFET with geometrical variations. All digital and analog/RF parameters are extracted and analyzed based on gate length (), sheet thickness (), sheet width (), and spacer material variations. As is varied from 8 nm to 12 nm, is enhanced from 0.249 × 108 to 2.86 × 108 due to improved gate control over the channel region which is also reflected in DIBL to 40.82 % whereas, at lower analog/RF metrics are better. The play a vital role in device characteristics, as decreases the chance of interaction of electric field from source to drain decreases owing to full volume conduction and thereby ameliorated performance of JL NSFET. As is varied from 7 nm to 5 nm, all electrical characteristics are improved and analog/RF parameters , , , TFP and GTFP are improved to 10.3 %, 18.4 %, 12.1 % 18.5 % and 54.04 %, respectively. Increase in from 10 nm to 20 nm results into increased effective width of a device, it leads to higher current which further impacts on electrical and analog/RF parameters. The DIBL, , , GFP, TFP and GTFP are enhanced to 63.7 %, 37.9 %, 34.9 %, 9.7 %, 33.5 %, 9.1 %, respectively. The spacer materials are varying from Al2O3 (k = 18), HfO2 (k = 22), ZrO2 (k = 25) to TiO2 (k = 44), the electrical characteristics are better at higher-k whereas analog/RF performances are superior at lower-k. Further, digital circuit elements NOT, NAND and NOR gates are designed, simulated and the delays are examined as 4.25ps, 6.45ps and 5.12ps, respectively. The and of NOT gate are noticed as 295 mV and 280 mV at 0.7 V of supply voltage. Furthermore, a common source (CS) amplifier is also simulated and gain of 3.3 is noticed. The aforementioned analysis revels the JL NSFET is best suitable candidate for future nanoscale applications.

IEEE Transactions on Industrial Electronics Information for Authors

IEEE Transactions on Industrial Electronics Information for Authors

3D printed lightweight honeycomb vent structures with subsequent coating of silver nanowires for efficient electromagnetic interference (EMI) shielding

In light of the rapid advancements within the electronic industry, the urgent need for the development and implementation of advanced electromagnetic interference (EMI) shielding materials has become paramount. Herein a novel approach is presented for developing of lightweight honeycomb structures using 3D printing technology, combined with subsequent conductive spray coating, containing Silver Nanowires (AgNWs), to achieve effective EMI shielding as well as air vent functionality for thermal cooling.Using polyol method, AgNWs were synthesized having high aspect ratio and crystallinity for to be used as conductive coating on 3D printed structures. The EMI shielding results in X-band demonstrated that the developed structures exhibit promising EMI shielding properties, up to 35 dB attenuation with 2 mm honeycomb cell size, making them suitable for applications requiring EMI protection along with air venting. More importantly in all samples major contribution of the shielding efficiency comes from the absorption of the EM waves (up to 75 %) inside the structures which is helpful to reduce reflected EM noise.Effort was to effectively addresses the inherent limitations of conventional processing technology, by using additive manufacturing and material science to create structures for EMI shielding applications, bridging the gap between existing materials and desired components.

Effect of Silicone Rubber on the Properties of Epoxy/Recovered Carbon Black (rCB) Conductive Materials

The primary focus of this study is to investigate the effect of silicone rubber (SR) content on the mechanical, thermal, electrical conductivity, and morphological properties of epoxy/recovered carbon black (rCB) conductive material. The conductive material is used to produce the electrostatic discharge (ESD) tray for the electronic packaging industry. This study investigated the effect of silicone rubber content (0, 5, 10, 15, and 20 vol.%) on the properties of epoxy/SR/rCB conductive materials, with the rCB content fixed at 15 vol.% for its optimum electrical conductivity. The silicone rubber acts as a toughening agent for epoxy. Through the fracture toughness result, it can be identified that silicone rubber plays a role in improving the toughness properties of the epoxy/SR/rCB conductive material. The optimum results for mechanical properties were recorded at 5 vol.% SR. The addition of SR to the epoxy matrix enhances the electrical properties of the epoxy/SR/rCB conductive material. The effect of thermal aging on epoxy/SR/rCB conductive materials was also studied to determine the properties of the conductive material materials at high temperatures for a long period of time. After thermal aging, the mechanical, thermal, electrical conductivity, and morphological properties of the epoxy/SR/rCB conductive material were slightly reduced.

Strain rate-dependent tensile deformation and failure behavior in single-crystal β-Sn

Given that electronic components often undergo intricate thermal and mechanical loads during operation, comprehensively understanding lead-free solder, particularly solder based on [Formula: see text]-Sn, in various complex load conditions, plays a crucial role in ensuring the structural integrity and functional reliability of integrated circuits. Therefore, investigating the mechanical properties and fracture behavior of [Formula: see text]-Sn as a solder material holds paramount importance. In this study, we performed molecular dynamics simulations using the modified embedded atom method to investigate the mechanical properties and crack propagation of single-crystal [Formula: see text]-Sn under different strain rates. The research findings demonstrate that as the strain rate increases, the single-crystal [Formula: see text]-Sn exhibits elevated yield strength, fracture strength, and strain, while the elastic modulus decreases. Under higher strain rates, the relationship between dislocation density and strain rate in single-crystal [Formula: see text]-Sn is quantitatively elucidated. The substantial increase in internal dislocation density imparts conspicuous strain hardening to the material, rendering plastic deformation more challenging. This observation sheds light on the microscale mechanism of strain hardening at the atomic level. Our results shall facilitate a deeper investigation into the mechanical behavior of single-crystal [Formula: see text]-Sn while also paving the path for optimizing the design and application of lead-free solder materials in the electronics industry.

Evolutionary neural network modeling of import substitution in the electronics industry of regions

Subject. This article focuses on the issues of evolutionary neural network modeling of import substitution capabilities and opportunities. Objectives. The article aims to study evolutionary neural network modeling in terms of identifying opportunities for import substitution in the electronics industry in the regions of Russia. The article also aims to identify the regions that are leaders in terms of the possibility of import substitution, and the regions that have prospects for the future development of the electronics industry within their territory. Results. The article presents the author-developed methodology for evolutionary neural network modeling of the possibility of import substitution in the electronics industry of the regions. Conclusions and Relevance. The results obtained can be useful for government agencies to plan the import substitution process in the electronics industry in regions mentioned. Investors can also use these results to choose the area of capital investment of their funds.